XCF128XFT64C

Product Summary

The XCF128XFT64C is a platform flash XL high-density configuration and storage device. A reliable compact high-performance configuration bitstream storage and delivery solution is essential for the high-density FPGAs. Platform Flash XL of the XCF128XFT64C is the industry highest performing configuration and storage device and is specially optimized for high-performance FPGA configuration. Platform Flash XL integrates 128 Mb of in-system programmable flash storage and performance of the XCF128XFT64C features for configuration within a small-footprint FT64 package (Figure 5). Power-on burst read mode and dedicated I/O power supply of the XCF128XFT64C enable Platform Flash XL to mate seamlessly with the native SelectMAP configuration interface. A wide, 16-bit data bus delivers the FPGA configuration bitstream at speeds up to 800 Mb/s without wait states. See UG438, Platform Flash XL Configuration and Storage Device User Guide of the XCF128XFT64C, for system-level usage and performance considerations.

Parametrics

XCF128XFT64C absolute maximum ratings: (1)TA Ambient operating temperature: –40 to 85 ℃; (2)TBIAS Temperature under bias: –40 to 85 ℃; (3)TJ Junction temperature: – 125 ℃; (4)TSTG Storage temperature: –65 to 125 ℃; (5)VIO Input or output voltage: –0.5 to 4.2 V; (6)VDD Supply voltage: –0.2 to 2.5 V; (7)VDDQ Input/output supply voltage: –0.2 to 3.8 V; (8)VPP Program voltage: –0.2 to 10 V; (9)IO Output short circuit current: – 100 mA; (10)TVPPH Time for VPP at VPPH: – 100 hours.

Features

XCF128XFT64C features: (1)In-System Programmable Flash Memory Optimized for Virtex5 or Virtex-6 FPGA Configuration; (2)High-Performance FPGA Bitstream Transfer up to 800 Mb/s(50 MHz 16-bits), Ideal for PCI ExpressEndpoint Applications; (3)MultiBoot Bitstream, Design Revision Storage; (4)FPGA Configuration Synchronization (READY_WAIT）Handshake Signal; (5)ISESoftware Support for In-System Programming via　XilinxJTAG Cables; (6)Standard NOR-Flash Interface for Access to Code or　Data Storage; (7)Operation over Full Industrial Temperature Range(0℃ to +85℃); (8)Common Flash Interface (CFI); (9)Low-Power Advanced CMOS NOR-Flash Process; (10)Endurance of 10,000 Program/Erase Cycles Per Block.

Diagrams